招聘职位
Package Integration Position（重庆）
- 公 司：NO.250-国资半导体FAB
- 工作地点：重庆
- 发布日期：2012-11-08
- 职位编号：2960
- 有效状态：已关闭
职位描述
Provide technical leadership, package design/development, chip-package integration, and sustaining support for power discrete devices or semiconductor assemblies.
Define overall package mechanical and electrical performance and specification.
Realize technology qualification through test vehicle design, Design of Experiments, and material and component selection.
Conduct tests and research on basic materials and properties.
Establish material specifications for contract assemblers and raw material vendors.
Interface with Quality Assurance, external final manufacturing and purchasing regarding material quality and vendor performance.
Provide consultation concerning packaging problems and improvements in the packaging process.
Respond to customer/client requests or events as they occur.
Develop solutions to problems utilizing expertise in the area, formal education, data collected experimentally or published, and research and development.
Ultimately deliver new technology on time to support new product introduction.
职位要求
5+ year experience with wafer level chip scale packaging and system in a package.
Expertise in mechanical modeling, solid mechanics and material science.
Knowledge and experience with material characterization, fluid mechanics, finite element analysis, thermodynamics, heat transfer and numerical simulation.
Experimental mechanics/hands-on experience.