招聘职位
Sr. Reliability Engineer
- 公 司:NO.264-A global PC leading enterprise
- 工作地点:深圳
- 发布日期:2014-04-03
- 职位编号:3491
- 有效状态:有效
职位描述
Position Description:
Develop reliability test plan for the company MEMS product based on good understanding of properties critical for sensor performance, material characteristics and limitations, mechanisms of their degradation;
Supervise reliability tests execution, analyze and report test results; facilitate accelerated development timelines;
Perform failure analysis of the sensor as a whole and its components, materials, coatings to support design and process team in improving sensor performance;
Job requires ability to plan, and consistently deliver against plan on development and release to production milestones.
Job responsibilities include:
Work in team environment on developing test hardware and software;
Lead reliability characterization of MEMS sensor and its internal components.
Work on failure analysis projects to give feedback to internal process and packaging development teams.
Deliver against the schedule and communicate status to various levels of management, peers and team members;
Work in a team environment to determine and improve product and material related issues;
Contribute to the design and architecture of future products
职位要求
Education:
MS or PhD in Material Science, Material Engineering, Chemistry, or Physics.
Qualifications:
In depth understanding of properties and chemistry of organic (polymers) and inorganic materials/coatings; excellent knowledge of respective analytical methods, defectoscopy.
Experience with semiconductor packaging, flip-chip technology, adhesives, metallic and semiconductor thin films.
Proven record of successful analytical work related either to introduction of new products in the mass production, or supporting volume manufacturing;
Good knowledge and understanding of JEDEC, ASTM reliability test standards
Excellent verbal and written language skills (English).
Experience:
10+ Years minimum industry experience in conducting reliability tests and failure analysis.
Demonstrated track record of bringing microelectronic components to volume manufacturing.