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Job

芯片后端设计经理

  • Company:NO.662-Integrated circuit Design services Company
  • Location:上海
  • Date of post:2023-08-09
  • Job No:4146
  • Valid Status:Opening


Job Description

1. ASIC IC 设计芯片后端从RTL到GDSII; 
2. 具备完整的芯片Tapeout经验,后端布局规划(模块级或全芯片级); 
3. 熟悉STA静态时序分析及低功耗设计与分析; 
4. 物理验证能力LVS/DRC/ERC/LVL/RTO/ANT/LUP; 
5. 布局布线,电源网络设计,时序收敛,功耗分析,物理验证等,掌握其中一个或多个技能

Job Request

1. 硕士学位,微电子,计算机相关专业,超过5年以上的芯片后端实践经验; 
2. 具备熟练的脚本技能(比如TCL,Perl,Python,及后端设计flow); 
3. 熟练 P&R后端工具12 / 7nm工艺节点,从Netlist到GDSII的整个后端流程的经验(Floorplaning, Power,Planning, Placement & Optimization, CTS,Routing,ECO,RC/Spef,STA); 
4. 熟悉关于OCV,LVF,MC 优化和多功率设计的工作知识; 
5. 了解CPU,DDR,Clock Structure,及基本数字逻辑; 
良好的沟通能力,英语读写顺畅。

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